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6A2T grinding wheels for back thinning LED substrate

6A2T grinding wheels for back thinning LED substrate

Back grinding wheels are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Alias: back grinding wheels, LED grinding wheels
Application: Synthetic sapphire, SiC,single crystal silicon
Brand: ZTSUPERHARD™
sale@ztsuperhard.com
Details

LEDBack thinning grinding wheels are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in our company can replace imported products. They can be used steadily on the Japanese, Korean grinders with high performance

Main Features

1. Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial water 

2. Material of workpiece: Synthetic sapphire, SiC,single crystal silicon 

3. Grinders: SHUWA, NTS, WEC, GALAXY. SPEEDFAM 

TyleModelDiameter (mm)thickness (mm)hole (mm)
6A26A2 grinding wheels17530, 3576
2003576
35045127
6A2T6A2T grinding wheels19522.5, 25170
28030228.6
6A2T-16A2T grinding wheels35035235
20922.5158
1A11A1 Diamond wheel40518.7

Other specification can be made according to customers requirements. Email: sale@ztsuperhard.com

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Get more about 6A2T grinding wheels for back thinning LED substrate, You can also contact sale@ztsuperhard.com
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