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Resin bond diamond grinding wheels for silicon wafers

Resin bond diamond grinding wheels for silicon wafers

Features:Long life,low prices; High heat conductivity, high wear resistance, and low coefficient

Work piece processed:silicon wafer of discrete devices and integrated chips(IC), etc.

Applications: back thinning, grinding and fine grinding.

Tyle:6A2,6A2H,6A2T,1A1

Size: D=175-350mm

Alias: silicon grinding wheels, diamond wheels for monocrystalline silicon
Tyle:6A2,6A2H,6A2T,1A1
Brand: ZTSUPERHARD™
sale@ztsuperhard.com
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Resin bond diamond grinding wheels for silicon wafers are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by ztsuperhard company, which possess superior grinding performance and high cost performance,are among the top level worldwide. They can be used with the Japanese, German, American, Korea and Chinese grinders.

Work piece processed: silicon wafer of discrete devices and integrated chips(IC), etc.

Material of work piece: monocrystalline silicon and some other semiconductor materials

Applications: back thinning, grinding and fine grinding.

Specification of centerless grinding wheels(mm)

TyleModelDiameter (mm)thickness (mm)hole (mm)
6A26A2 grinding wheels17530, 3576
2003576
35045127
6A2T6A2T grinding wheels19522.5, 25170
28030228.6
6A2T-16A2T grinding wheels35035235
20922.5158
1A11A1 Diamond wheel40518.7

Other specification can be made according to customers requirements. Email: sale@ztsuperhard.com

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Get more about Resin bond diamond grinding wheels for silicon wafers, You can also contact sale@ztsuperhard.com
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