Resin bond diamond grinding wheels for silicon wafers are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by ztsuperhard company, which possess superior grinding performance and high cost performance，are among the top level worldwide. They can be used with the Japanese, German, American, Korea and Chinese grinders.
Work piece processed: silicon wafer of discrete devices and integrated chips(IC), etc.
Material of work piece: monocrystalline silicon and some other semiconductor materials
Applications: back thinning, grinding and fine grinding.
| Tyle | Model | Diameter (mm) | thickness (mm) | hole (mm) |
| 6A2 |  | 175 | 30, 35 | 76 |
| 200 | 35 | 76 | ||
| 350 | 45 | 127 | ||
| 6A2T |  | 195 | 22.5, 25 | 170 |
| 280 | 30 | 228.6 | ||
| 6A2T-1 |  | 350 | 35 | 235 |
| 209 | 22.5 | 158 | ||
| 1A1 |  | 40 | 5 | 18.7 |
Other specification can be made according to customers requirements. Email: sale@ztsuperhard.com
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